The 3G electronic packaging materials can be made into high power LED packaging stands with MAX size of 80×80×3mm. It has unparalleled advantages compared to copper or ceramic stands.
Effective thermal cycling is 8 times of copper
Unique cooling channel with zero interfacial thermal resistance technique
Lighting effect meet general industry standard
AlSiC stand has probably the least photoelectric attenuation; it has the following features:
Non deformation when heated
Higher thermal conductivity than metals
No interfacial thermal resistance
In general, AlSiC may be the optimal packaging material developed so far. This is a result of its original purpose---to solve thermal failure of electronic devices. It has the following advantages
compared with other LED packaging stand materials:
Light: two thirds lighter than copper and close to aluminum
Hard: not easy to break or smash
Rigid: non-deform
Flexible: can be made into any shapes
Cheap: low cost material; everyone can afford it
Aesthetic: surface similar to metals after proper treatment