Housing

Hybrid Circuit Housing and Microwave Device Housing Serials

Hybrid Circuit Housing and Microwave Device Housing Serials

Dimensions of Finished Products


The 3G electronic packaging material can be processed to own various shapes. Current circuit packages and bases can all be made based on the designed drawing through net shape processing technique. At present, we can make housing parts of maximum size 220×150×30mm. Below are the photos of some finished products