The 3G electronic packaging materials can be made into various dimensions of substrates, baseplates, heatsinks, transitional plates etc. They possess high thermal conductivity, reliable size and are easy to weld, therefore optimal to solve thermal failures of electronic devices.
The 3G electronic packaging materials can be made into various dimensions of substrates, baseplates, heatsinks and transitional plates with high thermal conductivity, reliable size and easiness to weld so as to solve thermal failures of electronic devices. Products are made exactly based on customers’ drawings. At present, we can produce MAX size 220×150×30mm of such products. Below are some photos of finished products:
Following is a dimension table for finished products: (mm)
Length | Width | Height | Plating | Outside | Inside | |
MAX | 220 | 250 | 20 | yes | ±0.05mm | through hole, blind hole, screw hole |
MIN | 10 | 10 | 3 | yes |